PROFESSIONAL EXPERIENCE
MICROSOFT, Redmond WA ● August 12 – Present
Sr. Director: Manufacturing / New Product Introduction
AMKOR TECHNOLOGY, Chandler AZ ● August 11 – August 12
Director: FC Research and Development
Next generation microelectronic development.
• Developed the assembly and packaging design for Cisco Systems' largest form factor integrated electronic module.
• Developed optimized molded package designs for ultra-thin electronic form factors (e.g. tablets, ultra-books and cell phones).
INTEGRATED OUTSOURCE SOLUTIONS, Phoenix AZ ● June 09 – August 11
Consultant: Operations / Engineering / Manufacturing / Business Development
Leading a growth business in providing design and manufacturing outsource services to US based companies.
• Developed and implemented the all aspects of the business including strategy, annual plan, sales and marketing in supplying US-to-Asia manufacturing, design and procurement services. Company was profitable within 12 months.
• Secured strategic partnerships with key manufacturing companies in Malaysia and US.
MMI PRECISION TECHNOLOGY, Phoenix AZ ● Mar 08 – June 09
Director of Aerospace Operations
After selling Advanced Technology Manufacturing to KKR, continued to lead the organization to support customer demand and grow new capabilities/systems in support of our overall company strategic objectives.
• Delivered $8M per plan in annual booked revenue.
• Won $30-50M long term contracts and achieved "Strategic Supplier" status at Honeywell.
• Reduced days of inventory by 34% within a 4 month period.
• Met an aggressive goal of 15% per quarter improvement cycle in revenue per worker and inventory reduction.
• Reduced WIP inventory 10% per month on average through the implementation of key metrics, cost management systems and lean operational improvements.
• Determined/implemented new capabilities/systems as required for profit improvement and lean initiatives.
• Directed all aspects of company operations: P&L, HR, engineering, materials, quality and manufacturing.
• Successfully managed over 800 discrete product line items at sub 100PPM quality and 99%+ OTD.
ADVANCED TECHNOLOGY MANUFACTURING (ATM), INC., Tempe AZ ● Mar 05 – Mar 08
Chief Executive Officer and Co-owner
Rapidly grew annual revenue to over $8M from $1M within a 3 year period through effective leadership and business development strategies.
• Generated Annual Business Plans and assured leadership executed to plan through effective monitoring.
• Developed strategy and executed to a off shore manufacturing alliance with multiple Asian companies.
• Led and grew company infrastructure, staffing and engineering/quality systems at a rate of 45% per year that resulted in becoming a strategic supplier to fortune 100 companies such as Honeywell and Raytheon.
• Due to its phenomenal success, ATM was sold in 2008 to KKR (world’s #1 ranked private equity firm).
INTEL CORPORATION (Assembly Technology Development), Chandler AZ ● Oct 90 – Mar 05
Sr. Staff Engineering Manager (Oct 99 – Mar 05)
Managed Intel’s “Factory of the Future,” a global/cross-functional development program. Encompassed multiple organizations in the areas of research, development and factory, focusing specifically on defining the next generation back-end assembly and test manufacturing processes.
• Enabled new generation equipment platforms with two key strategic suppliers, meeting a 2X output goal and a significantly lower (40%) cost of ownership.
• Realized >$385M in savings with over 50 projects under my leadership.
Managed a new innovative Flip Chip assembly process development program for Intel’s next generation CPU.
• Successfully developed the process as a strategic enabler to support a low K dielectric chip architecture.
• Led a cross-functional team consisting of 100+ engineers spanning the areas of equipment, process, materials, operations, automation and manufacturing systems development.
Co-managed a group of 104 research and development engineers and senior engineering technicians.
• Led all micro-processor assembly development process teams, from wafer preparation and SMT assembly through final packaging. This scope spanned 2+ generations of packaging technologies.
• Delivered consistently to achieve goals within department budgeting, hiring and team development targets.
New Technology Platform Manager (May 98 – Oct 99)
Co-managed a global/cross-functional team to develop the Flip Chip Pin Grid Array micro-processor packaging technology. This was a break-thru, award winning micro processor package and achieved the record in lowest cost for Intel. Scope included initial package development through high volume worldwide factory deployment.
• Realized >$100M in savings over the existing technology in both BOM cost and yield.
• Led team of over 300 engineers spanning across Malaysian and US sites.
• Directed the strategic/tactical growth and development of the team, staffing, planning and budgeting.
• Defined and drove technology development roadmap and timeline for product launch schedule.
• Communicated regularly to customers and partners worldwide on program progress against plan/goals.
Sr. Engineering Manager (Apr 96 – May 98)
Managed assembly process development for all “next generation” microprocessor technologies.
• Led joint Engineering teams that spanned across Intel’s worldwide factory environment.
• Successfully deployed the technology from the US to both the Philippines and Malaysia.
Staff Engineer (Jun 94 – Apr 96)
Developed an Ultra-Fine-Pitch assembly cell for laptop microprocessor application and process certifications.
• Partnered with key equipment suppliers to develop effective process tools prior to product launch dates.
• Enabled and certified Taiwanese subcontract manufacturers to support technology acceptance in Asia.
Sr. Manufacturing Engineer (Oct 90 – Jun 94)
Developed automated pin and frame assembly equipment for PCMCIA applications on time.
• Developed and implemented various new process materials and equipment to improve first pass yields.
• Qualified and implemented no-clean solder pastes to support the company’s “green” initiatives.
TEKTRONIX INC., Beaverton OR ● Feb 88 - Oct 90
Manufacturing Engineer
To support the company’s strategic initiative of electronics miniaturization, implemented no-clean surface mount circuit board processes, concentrating in: fine pitch technology assembly implementation.
ALLIANCE AUTOMATION SYSTEMS, Santa Clara CA ● May 86 – Feb 88
Automation Engineer
Delivered new product designs and existing product optimization.
LOCKHEED MARTIN, Sunnyvale, CA ● May 84 – Aug 84
Engineering Internship
Designed key mechanical validation test setups for the Electronic Engineering Organization.